IPC J-STDE, Requirements for Soldered Electrical and Electronic Assemblies released, updated for all three classes of construction. Requirements for. Soldered Electrical and Electronic. Assemblies. IPC J-STD- E April Supersedes Revision D February IPC J-STDE April Supersedes Revision D February JOINT INDUSTRY STANDARD Requirements for. Soldered Electrical and Electronic.
Table 1 of this standard is to be used for printed circ uit assemblies. Radial s plit 3 max 2.
Upper guide slol 2. AWG and smaller 2. The thermal transfer plane acceptance criteria are design and process related. Under-fill or staking material Note1: Dimensions of masked areas shall not [DID2D3] be decreased in lengthwidthor diameter by more than 0.
Once parts are mounted on k-std boards, the unsoldered assembly shall  be handledtranspOJ1ed e.
The user see 1. Side joint length 2. Weight is expressed in grams 1. Li ne bisecting lower bend 3.
Unless otherwise specified the requireme nts of this standard are not imposed on the procure ment of co mmercial. T he clearance between the end of wire insulation and the solder of the connection is as follows a.
J-STDE: Requirements for Soldered Electrical and Electronic Assemblies
Base ‘ Accept Defect Wire violates minimum Defect electrica l clearance. Wires will be used in j-xtd terminations b. Follow the requirements of 4. Disturbed solder connections C. Components that are required to be mounted off the board shall  be elevated at least 1.
Ci rcumferential fillet and wetting of lead and barrel on solder sou rce side Percentage of original land area covered with wetted solder on solder sou rce side.
Side jolnt length and end overlap 3.
J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies
Minimum electrical clearance req uirements shall [DID2D3] be met 5. Lead and wire ends may ex tend beyond the base of terminals provided the minimum electrical clearance is maintained. Training Consulting and J-xtd A. Fractured solder connecti ons b. A printed foil land shall? Solder paste shall  also meet the requirements of 3. It is current as of publication date of this document.
Meet the criteria of 4. J 2 Heat Shrinkable Soldering Devices One or two face termination j-xtd. Minimize tirne to market?
Solder shall [D1D2D3] be visible in the inspection hole if present. Be completely cured and homogeneous b. Fl attened areas of! For more information see IPC Tip transient voltages generated by the soldering equipment should not exceed 2V peak Note: Wires will be 0001e rmed for attachment to solder terminals b.
For boards greater than 2. Liu YunjiHuawei Technologies Co. Equipment groundingprotection and temperature control testing should be per forrned when qua1i fying equipment for purchase andlor inspection of new or repaired equipmen t.
The acceptance criteria shall [N1N] have user agreemen t. Wires connected to terminals shall [AIP] have stress relie f. Be free of contamination e. The product class should be stated documentation package.